![]() It is not meant to be an exhaustive list and is not meant to preclude the potential use of other alloys. Below is a reference listing of Pb-free alloys in order of melting point. Kester is a licensee of ISURF SnAgCu(Bi) patent 5,527,628, Senju-Matsushita SnAgCu(Bi) patent 3027441 and Oatey SnAgBiCu patent 4,879,096. The predominant SnAgCu alloy in use in Japan is SnAg3.0Cu0.5 and increasing trend elsewhere as well. About 3/4 of companies use SnAgCu for hand soldering. For wave soldering SnCu and SnAg are also used to a lesser degree. For surface mount reflow SnAg, SnZnBi, SnAgCuBi and SnInAgBi are also used to a lesser degree. In Japan 2/3 of companies use SnAgCu for reflow and wave soldering. NIST has defined the true eutectic composition as SnAg3.5Cu0.9. The true eutectic composition has been argued to be within the range SnAg(3.5-3.8)Cu(0.7-1). SOLDERTEC lead-free roadmap in Europe recommends alloy range SnAg(3.4-4.1)Cu(0.45-0.9) for reflow and wave soldering.The SnAgCu family is the alloy of choice for all regions of the world at present. The IDEALS consortium in Europe preferred SnAg3.8Cu0.7 for reflow soldering and SnAg3.8Cu0.7Sb0.25 for wave soldering. JEITA also recommends SnAg3.0Cu0.5 for wave soldering with SnCu as a secondary alternative. The JEITA lead-free roadmap in Japan recommends SnAg3.0Cu0.5 for reflow soldering with SnAg and SnZnBi as secondary alternatives. The NEMI consortium in USA recommends SnAg3.9Cu0.6 for surface mount reflow soldering and SnCu0.7 for wave soldering. The roadmap recommends that industry leaders develop a system for labeling. The roadmap recommends a solder alloy composed of Sn-Ag-Cu for board assembly.– Complete lead elimination from products by the end of 2005. Assemblies: – Manufacturing of lead-free soldered assemblies began by the end of 2002.– Complete line-up of lead-free components by the end of 2004. – Complete line-up of components with lead-free terminations by the end of 2003. Components – Some availability of lead-free components since the end of 2001.The roadmap suggests that leading manufacturers are expected to conform to these time frames one year ahead of schedule while other manufacturers may reach them 2 years later. Recommends the following schedule for manufacturers.In addition to phasing out lead, the RHS mandates a phase out of: – Cadmium – Mercury – Hexavalent Chromium – Two types of brominated flame retardants.This directive makes lead-free a requirement for products on sale to European Consumers after this date. RHS ban on hazardous materials confirmed as July 1, 2006.Agreement on the EU WEEE (Waste Electrical and Electronic Equipment) and RHS (Restriction of Hazardous Substances in Waste Electrical and the Electronic Equipment) Directives.– The recommendation that industry adopts the use of 0.1weight percentage as a maximum allowable percentage lead in “lead-free” products. Recommendations: – Manufacturers have a complete inventory of lead-free components by the end of 2004.Iinvolves Europe’s SOLDERTEC and Japan’s JEITA (Japan Electronics and Information Technology Industries Association).Launched at the 2nd Lead-free Summit meeting in November 2002.Japan and Europe “International Lead-Free Soldering Roadmap Framework” South Carolina - Bill introduced on state wide electronics recycling.New Jersey - Pilot program for electronic recycling (3 & 6 graders).Florida - Pilot program of end-of-life for some electronics.Connecticut - General permit for collecting some recyclables (early 2000).California - Updated list yearly of toxic chemicals.Status of the Lead-Free Issue in a Number of States Assist in modifying industry standards for Pb-free.Total lead elimination by 2004 on a voluntary basis.Intends for North American companies to produce lead-free products by 2004.NEMI at APEX ’00 has named Sn 95.5Ag3.9Cu0.6 (☐.2%) as its choice for a lead-free alloy candidate.An alloy is considered to be lead-free if it contains NCMS -found 3 possible replacements for lead-alloys out of 80 considered -No drop-in replacements.NEMI Association has formed a Lead-Free Task Force to investigate alternatives to lead bearing alloys. Pressure is mounting from offshore communities to eliminate lead use.Recycling of solder in electronic products is possible, but could become a large cost.Lead is currently on its list of hazardous materials. EPA to reduce the use of hazardous materials. Lead is permitted in solder for electronics: however, the American Industry was asked by the U.S.Lead has already been banned by law in paint, automobile fuel, food cans, automobile body solders, light bulbs and plumbing solder and fixtures.Summary of Legislation, Regulations and Directions USA Legislation ![]()
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